OCM Manufacturing Adds State of the Art Equipment To Accommodate Advanced Designs
New technology provides high-speed flip-chip, bare die, large IC and odd-form placement for low-volume tech products
OCM Manufacturing, an Ottawa-based contract electronics manufacturer serving small- and mid-size companies, today announced it has added advanced component placement capabilities in its Thurston Drive facility. Through acquisition of Siemens SIPLACE F5HM technology, OCM will provide its customers with high-speed flip-chip, bare die, large IC and odd-form placement.
George Henning, VP Manufacturing at OCM, said, “This is great news for the small- and mid-size original equipment manufacturers (OEM) with low-volume products whom we serve, because the SIPLACE technology accommodates the most advanced printed circuit board designs. Now, small customers with very advanced designs will be able to work with a contract manufacturer that matches their size, volume and level of innovation.”
The SIPLACE F5HM machine supports micro ball-grid array (BGA) and chip-scale packages, boards as large as 18” x 24”, and high-density products through its flip chip capability. Its extremely high degree of flexibility enables the SIPLACE F5HM to place the complete range of SMT components with maximum accuracy.
OCM customers will also benefit from improved throughput and optimized asset utilization, Henning added: “We have standardized on Siemens as our placement vendor, so our line can be balanced and optimized more effectively, with a single feeder platform and a single set of spare components. That translates into better return-on-investment for OCM, and our customers in turn benefit from lower-cost products.”
About OCM Manufacturing
Since 1998, OCM Manufacturing has provided high quality contract electronics manufacturing and supply chain services tailored for small- to mid-size companies. OCM is located in Ottawa, Ontario, close to major centers such as Toronto, Montreal and the northeastern United States. OCM is ISO 9001:2000 registered.